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■ RELIABILITY DATA
18. Resisitance to vibration
LA Type
CAL45 Type
△ L/L : Within ± 5% 　 Q : 30min
△ L/L : Within ± 5%
LHL □□□
FBA/FBR
FL05 □ Type
FL06BT Type
【 Test Method and Remarks 】
Appearance : No abnomality
Appearance : No abnomality
△ L/L : Within ± 5% Q change : Within ± 30% (LHLP : only △ L/L)
Impedance change : Within ± 20%
LA, CA
: Directions
:
2 hrs each in X, Y and Z directions total : 6hrs.
Frequency range
Amplitude
Mounting method
Recovery
LHL FB ? ： Directions
Frequency range
Amplitude
Mounting method
19. Resistance to shock
LA Type
CAL45 Type
LHL □□□
FBA/FBR
FL05 □ Type
FL06BT Type
【 Test Method and Remarks 】
:
:
:
:
:
:
:
:
10 to 55 to 10Hz (1min.)
1.5mm
Soldering onto printed board.
At least 1hr of recovery under the standard condition after the test, followed by the measurement within 2hrs.
2 hrs each in X, Y and Z directions total : 6hrs.
10 to 55 to 10Hz (1min.)
1.5mm (But don't exceed acceleration 196m/s 2 (two power))
Soldering onto printed board.
No signi?cant abnormality in appearance
LA, CA
:
Drop test
Impact material : concrete or vinyl tile
Height : 1m
Total number of drops : 10 times
20. Solderability
LA Type
CAL45 Type
LHL □□□
FBA/FBR
FL05 □ Type
FL06BT Type
At least 75 ％ of terminal electrode is covered by new solder.
At least 75 ％ of terminal electrode is covered by new solder.
At least 90 ％ of terminal electrode is covered by new solder.
At least 75 ％ of terminal electrode is covered by new solder.
【 Test Method and Remarks 】
LA, CA : Solder temperature : 230 ± 5 ℃
Duration : 2 ± 0.5 sec.
LHL □□□ : Solder temperature : 235 ± 5 ℃
Duration : 2 ± 0.5 sec.
Immersion depth
: Up to 1.5mm from bottom of case.
FB
: Solder temperature : 230 ± 5 ℃
Duration : 3 ± 1 sec.
Immersion depth
: Up to 1.5mm from terminal root.
FL05R □
: Solder temperature : 230 ± 5 ℃
Duration : 2 ± 0.5 sec.
Immersion depth
: Up to 2 to 2.5mm from terminal root.
FL06BT
: Solder temperature : 230 ± 5 ℃
Duration : 3 ± 1 sec.
Immersion depth
21. Resisitance to soldering heat
LA Type
CAL45 Type
: Up to 0.5 to 1.0mm from terminal root.
No signi?cant abnormality in appearance
△ L/L : Within ± 5%
LHL □□□
FBA/FBR
FL05 □ Type
FL06BT Type
No signi?cant abnormality in appearance
No signi?cant abnormality in appearance
Refer to individual speci?cation
No signi?cant abnormality in appearance
Inductance change : Within ± 5%
Impedance change : Within ± 20%
Impedance change : Within ± 20%
Q change : Within ± 30%(LHLP : only △ L/L)
【 Test Method and Remarks 】
LA, CA : Solder temperature
Duration
Immersed conditions
Recovery
:
:
:
:
(CA) 270 ± 5 ℃ , (LA) 260 ± 5 ℃
5 ± 0.5 sec. One time
Inserted into substrate with t=1.6mm
At least 1hr of recovery under the standard condition after the test, followed by the measurement within 2hrs.
LHL □□□ : Solder bath method
Manual soldering
Caution
Recovery
: Solder temperature : 260 ± 5 ℃
Duration : 10 ± 1 sec.
Up to 1.5mm from the bottom of case.
: Solder temperature : 350 ± 10 ℃ (At the tip of soldering iron)
Duration : 5 ± 1 sec.
Up to 1.5mm from the bottom of case.
: No excessive pressing shall be applied to terminals.
: 4 to 24hrs of recovery under the standard condition after the test.
FB
: Solder bath method
Recovery
: Condition 1 : Solder temperature : 260 ± 5 ℃
Duration : 10 ± 1 sec.
Immersion depth : Up to 1.5mm from the terminal root.
Condition 2 : Solder temperature : 350 ± 5 ℃
Duration : 3 ± 1 sec.
Immersion depth
: Up to 1.5mm from the terminal root.
: 3hrs of recovery under the standard condition after the test.
FL
: Solder condition
: 260 ± 5 ℃
10 ± 1 sec.
Immersion depth
Recovery
: Up to 0.5 to 1.0mm from the terminal root.
: 3hrs of recovery under the standard condition after the test.
＊ This catalog contains the typical speci ?cation only due to the limitation of space. When you consider the purchase of our products, please check our speci ?cation.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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